Packaging Engineer Job Listing at AMD in San Jose, CA (Job ID 73013-en-us)

Description

WHAT YOU DO AT AMD CHANGES EVERYTHING 

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you'll discover the real differentiator is our culture. We push the limits of innovation to solve the world's most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.  Together, we advance your career.  

THE ROLE: 

We are looking for a candidate who can manage and collaborate with external packaging and assembly suppliers to achieve performance targets in New Product Introduction, Supplier Manufacturing Operations, and Quality and Reliability processes, while exploring new capabilities. AMD fosters an innovative and dynamic environment that values collaboration, continuous improvement, and technical excellence.

THE PERSON: 

The ideal candidate is a collaborative team member committed to meeting deadlines, with strong problem-solving skills and the ability to adapt in a dynamic environment. They should possess in-depth technical knowledge, excellent cross-functional project management capabilities, effective communication and presentation skills, and the ability to work independently when needed. Demonstrating inclusive leadership and a willingness to learn and grow within AMD is highly valued.

KEY RESPONSIBILITIES: 

• Drive IC packaging initiatives from product qualification to production ramp for next generation FCBGA & Advance Packages for high reliability Aerospace & Defense devices.   
• Collaborate with substrate and assembly suppliers to define process flow and process controls to enable high reliability manufacturing.
• Drive manufacturing process quality through FMEA and lead comprehensive reliability evaluations to determine the quality and reliability margin for the product.
• Drive data analytics program and detect manufacturing and product quality excursion to safeguard product quality. 
• Research and develop solutions to enhance package reliability for end users.
• Innovate methods to add more value to the product through optimizing product cost, yield and performance.
• Leads establishment, review and audit of manufacturing specification, control plan and FMEA for assembly supplier.
• Lead collaboration with suppliers to meet AMD's goals (cost, yield, quality and reliability) and continuous improvement activities.
• Lead investigations, risk assessments on quality activities including PCN, lot on holds, issues including MRB, customer complaints, RMA.

PREFERRED EXPERIENCE: 

• Hands on experience in end to end of Flip Chip BGA & Advanced Package assembly process. 
• Strong knowledge on industry standards. (Military specifications, JEDEC, Automotive) 
• Strong knowledge in FMEA & Control Plan methodology.
• Strong knowledge in data analysis tools. (JMP, Snowflake, Power BI…etc.)
• Experience on substrate, bump and assembly integration.
• Familiar with tools. (failure analysis knowledge, package reliability knowledge)
• Supplier quality management experience and a deep understanding of problem-solving tools including 8D principle and statistical process control principles.
• Track record of development work leading to volume production in Semiconductor manufacturing.  

ACADEMIC CREDENTIALS: 

Bachelor/MS degree in Engineering.

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Benefits offered are described:  AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process.