Description
WHAT YOU DO AT AMD CHANGES EVERYTHING
At AMD, our mission is to build great products that accelerate next-generation computing experiences – from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you'll discover the real differentiator is our culture. We push the limits of innovation to solve the world's most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.
Together, we advance your career.
THE ROLE
Lead a team of elite signal integrity engineers to develop a Product Design Guide for the industry's top GenAI accelerator
Drive innovation in high-speed signaling, rack-level interconnects, and PCB architecture to support next-gen AI hardware
Collaborate across packaging, SERDES, power, and board engineering teams to deliver breakthrough system designs
Operate at the forefront of AI infrastructure, pushing technical boundaries under aggressive timelines
THE PERSON
Visionary and technically strong leader with deep expertise in signal integrity, PCB design, and high-speed interconnects
Comfortable navigating complex cross-functional environments and driving alignment across silicon, system, and platform teams
Thrives under pressure and excels in delivering high-impact results on compressed schedules
Passionate about exploring copper and optical signaling technologies and scaling GenAI networking
KEY RESPONSIBILITIES
- Lead development of the GenAI Product Design Guide with a focus on signal integrity and system-level performance
- Collaborate with SERDES and packaging teams to ensure silicon meets GenAI leadership goals
- Drive model creation and simulation for ultra-high-speed signaling technologies
- Push the limits of copper interconnects and explore optical signaling for rack-level networking
- Partner with the Power Design team to deliver the highest power-capable PCB without compromising other domains
- Work with the PCB technology team to achieve industry-leading layer counts and quality
- Coordinate with Board Engineering and Layout teams to support the largest silicon package ever conceived
- Ensure success of unprecedented copper bandwidth Ethernet switching within the rack
ACADEMIC CREDENTIALS
- Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related technical field
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Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process.
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