Silicon Design Engineer Job Listing at AMD in 新竹市 (Job ID 78500-en-us)

Description

WHAT YOU DO AT AMD CHANGES EVERYTHING 

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you'll discover the real differentiator is our culture. We push the limits of innovation to solve the world's most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.  Together, we advance your career.  

THE ROLE:

The successful candidate will collaborate closely with internal teams including Design, Architecture, Si Development team, Heterogeneous Integration Team, and NPI teams. The role requires deep involvement in advanced CMOS technology nodes (3nm/2nm, and beyond) and 3D heterogeneous packaging process development, semiconductor characterization, and mask technology for products.

THE PERSON:

This role requires a candidate with a proactive mindset and the ability to work independently, while also demonstrating strong collaboration skills within a team-oriented environment.

KEY RESPONSIBILITIES:

• Support PPA evaluation for advanced CMOS technology nodes through close collaboration with internal product, design, and CAD teams, as well as external foundry partners.
• Provide data-driven and actionable feedback to internal stakeholders and foundries to accelerate mask readiness, delivery timelines, and quality sustainment for NPI products.
• Support the design, development, and characterization of 3D test chips, including silicon and packaging technology co-development for business unit applications. This includes identifying paths of record (POR) or alternative silicon–package integration options and driving them through qualification and ramp to volume production.

PREFERRED EXPERIENCE:

• Experience: Minimum of 7+ years in process manufacturing with strong problem-solving skills
• Specialized Knowledge: Preferred background in advanced CMOS processes and/or 3D device/advanced packaging technology.
  
  

ACADEMIC CREDENTIALS:

• Educational Qualification: Master's degree required; Doctoral degree preferred.
• Field of Study: Degree in Electrical Engineering, Materials Science and Engineering, or a related field.
  
  

LOCATION:

Hsinchu, Taiwan

• #LI-SC1
• LI-HYBRID 

Benefits offered are described:  AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position.  AMD's “Responsible AI Policy” is available here.

This posting is for an existing vacancy.